All our Suppliers have to pass a rigid qualification process. Therefore you can rest assured that the integrity of components on the boards are always of the highest standard.
We have dedicated "Prototype" lines for the smaller production runs, and we can migrate them to our higher volume assembly lines when the need arises.
SPC (Statistical Process Control) is integrated to our state of art SMT assembly lines to achieve the highest quality and reliability.
Our capabilities are:
AOI (Automated Optical Inspection)
BGA/Micro BGA (Ball Grid Array) assembly and X-Ray inspection
CSP and 0201 component
Fine Pitch and large components
Whether it is RoHS wave soldering or a secondary hand-soldering operation, our experienced staff will always manufacture to IPC Class II and Class III standards.
We apply aluminum wire bonding on wafer die in a controlled environment clean room. Our intensive testing of the pre/post epoxy processes ensures the product produced is of the highest quality.
We can construct an assortment of cable and wire harnesses, mechanical and sub assemblies, according to your required application and specifications.
We offer the following services:
JTAG– Flying Probe
Test Vibration Test
System Level Testing
Our selective coating machine can precisely give consistent thickness of conformal coating. We offer services for all industrial applications for both small and large volume projects.
We can provide “box build” solutions which have the flexibility of a variety of configurations to meet our customer’s request.
Whether it is just board level assembly and test, sub-modules or final product assembly, our highly skilled staff will always ensure we can meet or exceed your expectations.
DISCLAIMER: All products on this web-site are supplied as
Development Kits and so subject to change without notice. By placing your order with Globalscale Technologies Inc. you expressly agree to comply with all the United States Foreign Corrupt Practices Act and all applicable export laws.
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